Comstar 10-801 Copper Lock No Heat Solder 10 mL

Description

Comstar 10-801 Copper Lock No Heat Solder 10 mL
Product Description
This unique product instantly bonds copper and brass pipes/fitting without the use of heat or metal solder. Copper Lock’s patent pending formula allows for it to withstand pressures of 10,000 PSI flow and 500 PSI contained. It can also withstand temperatures from -60F to +300F. It is good for all yellow metals, copper and brass pipe and fittings and for all refrigerants and liquids. It can handle water systems pressure tests in 2 minutes and A/C system pressure test in 25 minutes. Copper Lock can also be disassembled at 400F heat and then reapplied. Environmentally safe.
Features
ComStar’s Copper Lock is the revolutionary method for soldering pipes! Designed for the US Space Program!
Simply apply it inside the connector and/or onto the pipe (or both); making sure the liquid is totally around the circumference, fit in the pipe and within 60 seconds a permanent leak-proof seal will prevail.
No heat or solder is required to create a permanent leak-proof bond.
10ml bottle will bond as many as 40 3/8 inch fittings.
Exceeds all US Military copper bonding specifications: Mil-S-46163A Type I Grade K, Mil-S-224723E Letter Grade CVV.