-40%

MG Chemicals 4900-112G 96.5Sn/0.5Cu/3Ag No Clean Lead Free Solder 0.032" NEW!!!

$ 16.36

Availability: 22 in stock
  • All returns accepted: Returns Accepted
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Brand: MG Chemicals
  • Condition: New
  • Return shipping will be paid by: Seller
  • Model: 4900-112G
  • MPN: 4900-112G

    Description

    MG Chemicals 4900-112G 96.5Sn/0.5Cu/3Ag No Clean Lead Free Solder 0.032" NEW!!!
    Condition:
    New
    Manufacturer: MG Chemicals
    Part Number:
    4900-112G
    96.5% tin, 0.5% copper and 3% silver
    M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder
    Features / Benefits
    Lead free
    Complies with RoHS
    Exceeds the impurity requirements of J-Std-006
    No Clean flux
    21 Gauge, 0.032" diameters
    Excellent wettability
    Hard non-conductive residues
    1 lb of lead free solder has 27% more length than leaded solder
    Flux Percentage
    M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.
    Flux Core
    A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.