Silver Conductive Epoxy Cold Solder Circuitry Printed Circuit Board 2.5gm, 902

Description

Technical Product Bulletin
PURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY MAXIMUM CONTINUITY OF CONDUCTIVITY
PRODUCT DESCRIPTION:
This product is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1
x
10-4
ohm•cm.
It is also characterized by a wide operating temperature range from –50 to +170°C.
This product is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
GENERAL PROPERTIES
APPEARANCE
Silver
CURE TYPE
Heat cure or Room temperature
BENEFITS
High strength
Perfect bond
Cold solder for heat sensitive components
MIX RATIO BY WEIGHT
100:7 / Resin:Hardener
SUBSTRATES
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
OPERATING TEMPERATURE
-50 to 170 °C
TYPICAL APPLICATIONS
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
UNCURED PROPERTIES
VISCOSITY @ 25 °C CPS
Paste
SPECIFIC GRAVITY, MIXED
2.79
REACTIVE SOLIDS CONTENTS, %
100
POT LIFE
30 minutes
CURE SCHEDULE:
2 MINUTES
@ 120°C
5 MINUTES
@ 100°C
12 HOURS
@ 25°C
MISC PROPERTIES:
HARDNESS, SHORE D
83
SHRINKAGE LINEAR IN/IN
0.003
LAP SHEAR STRENGTH, PSI
9400
VOLUME RESISTIVITY OHM CM
> 0.0001
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1)
Carefully clean and dry all surfaces to be bonded.
2)
Apply this compound completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages
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